Center for Materials Research

Sputter Coating

BOC Edwards Auto 306 Sputter System

Our machine is capable of sputtering a wide range of materials using both RF and DC power. The chamber can be cryocooled with liquid nitrogen and has a typical pump down pressure of 2.0 10-7 Torr. We have four sample supports: 3" wafer (6), 4" wafer (6), 12" diameter plate, 5" x 8" paddle.

 

         TARGET MATERIALS INSTRUCTION MANUAL
            SPUTTER RECIPES THIN FILM EVAPORATION GUIDE

 

LIVE! SPUTTER CAMERA

User Name: user

Password: cleanroom

 

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Center for Materials Research, PO Box 642711, Washington State University, Pullman, WA, 99164-2711 USA