Center for Materials Research

Plasma Etching

South Bay Technologies PE 2000

 

This machine is currently configured for manual control of O2 and CF4 gasses and can be used to etch isotropically, clean wafers and bond polymers.

Contact Us: cmr@wsu.edu | Telephone: (509) 335-1131 | Accessibility | Copyright | Policies
Center for Materials Research, PO Box 642711, Washington State University, Pullman, WA, 99164-2711 USA