Center for Materials Research

Cleanroom Process Capabilities

 

 

Select from the list below for additional information on specific processes and available equipment.

 

Thin Films

•Atomic Layer Deposition (New!!!)
•Sputter Coating
•Spin Coating

 

Photolithography

•Mask Aligner
•Mask Fabrication

Wet Etching

•Acid
•BOE
•Solvent

Thermal Processes & Equipment

•Rapid Thermal Annealing
•Oxidation Growth
•Boron Diffusion
Vertical Furnace
•Vacuum Oven
•Thermal Hydraulic Press

 

Dry Etching

•Plasma
•Reactive Ion
•Deep Reactive Ion

Measurement

•Profilometry
•Ellipsometry

 

Wire Bonding

•Ball
•Wedge

 

 

Contact us: joshah_jennings@wsu.edu (509) 335-8145 | Accessibility | Copyright | Policies
WSU Microfab Facility, PO Box 642711, Washington State University, Pullman, WA, 99164-2711USA

 


 

Contact Us: cmr@wsu.edu | Telephone: (509) 335-1131 | Accessibility | Copyright | Policies
Center for Materials Research, PO Box 642711, Washington State University, Pullman, WA, 99164-2711 USA